Chip package structure and electronic device

ABSTRACT

The present application provides a chip package structure and an electronic device, which could reduce a chip package thickness and implement ultra-thinning of chip package. The chip package structure includes a chip, a substrate, a lead and a lead protection adhesive; the lead is configured to electrically connect the chip and the substrate; the lead protection adhesive is configured to support the lead, where a highest point of the lead protection adhesive is not higher than a highest point of an upper edge of the lead.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation in part of International ApplicationNo. PCT/CN2019/091235, filed on Jun. 14, 2019, the disclosure of whichis hereby incorporated by reference in its entirety.

TECHNICAL FIELD

The present application relates to the technical field of opticalfingerprints, and in particular, to a chip package structure and anelectronic device and a method for preparing a chip package structure.

BACKGROUND

At present, in a process of packaging an electronic chip, two mannersare generally adopted for packaging a lead: molding package anddispensing package. A common dispensing package method is to completelywrap a first solder joint, a second solder joint of a lead and the leadwith a protection adhesive, so as to play a protective role. Therefore,in this dispensing package method, a height of the protection adhesiveneeds to be higher than a height of the lead thereby occupying entirethickness space of a packaged product, which is not conducive todevelopment of ultra-thinning of a product.

SUMMARY

Embodiments of the present application provide a chip package structureand an electronic device and a method for preparing a chip packagestructure, which could reduce a chip package thickness and implementultra-thinning of chip package.

According to a first aspect, provided is a chip package structure,including: a chip, a substrate, a lead and a lead protection adhesive;

where the lead is configured to electrically connect the chip and thesubstrate;

the lead protection adhesive is configured to support the lead, where ahighest point of the lead protection adhesive is not higher than ahighest point of an upper edge of the lead.

According to a solution of an embodiment of the present application, aheight of a lead protection adhesive is controlled such that a highestpoint of the lead protection adhesive is not higher than a highest pointof the lead and the lead protection adhesive can support the lead,thereby avoiding an increase in an additional thickness of a chippackage product and implementing ultra-thinning of the product while thelead protection adhesive may ensure mechanical reliability of the lead.

In one possible implementation manner, the highest point of the leadprotection adhesive is not lower than a highest point of a lower edge ofthe lead.

In one possible implementation manner, the lead protection adhesivecovers a lower edge of the lead.

In one possible implementation manner, the chip is an opticalfingerprint sensor chip, and is configured to receive a fingerprintdetection signal returned by reflection or scattering of a human fingerand detect fingerprint information of the finger based on thefingerprint detection signal.

In one possible implementation manner, the chip includes a pin pad andthe substrate includes a substrate pad; and

the lead is configured to electrically connect the pin pad and thesubstrate pad.

In one possible implementation manner, the lead protection adhesivecovers a first solder joint formed on the substrate pad by the lead anda second solder joint formed on the pin pad by the lead, and isconfigured to protect the first solder joint and the second solderjoint.

In one possible implementation manner, the lead is connected to the pinpad through a metal ball.

In one possible implementation manner, the lead and the metal ball areof an integral structure.

In one possible implementation manner, a first segment of the lead inthe lead is located above the chip, and a distance between a lowestpoint of the first segment of the lead and an upper surface of the chipis not greater than 10 μm.

In one possible implementation manner, the lowest point of the firstsegment of the lead is in contact with the upper surface of the chip.

In one possible implementation manner, a distance between the highestpoint of the lead and an upper surface of the chip is not greater than35 μm.

In one possible implementation manner, the chip package structurefurther comprises a chip attaching adhesive, which connects the chip andthe substrate;

a thickness of the chip is between 50 μm and 600 μm, a thickness of thesubstrate is between 100 μm and 350 μm, and a thickness of the chipattaching adhesive is between 10 μm and 35 μm.

In one possible implementation manner, the chip further includes: a testmetal unit; and the test metal unit is disposed in an edge region of thechip that is not under the lead.

In one possible implementation manner, the pin pad is located on oneside of the chip, and the test metal unit is located on at least oneside of other three sides of the chip.

In one possible implementation manner, the lead is a lead fabricatedfrom the substrate pad to the pin pad by employing a reverse wirebonding process.

In one possible implementation manner, the lead is a gold wire, silverwire or copper wire; and/or

the lead has a wire diameter of 15.2 μm to 25.4 μm.

In one possible implementation manner, the chip is disposed on an uppersurface of the substrate.

In another possible implementation manner, an upper surface of thesubstrate extends downward to form a first groove, and at least aportion of the chip is disposed in the first groove.

In one possible implementation manner, a size of the first groove isgreater than a size of the chip such that there is a gap foraccommodating the lead between a side wall of the chip and a side wallof the first groove.

In one possible implementation manner, a depth of the first grooveincludes a thickness of a cover film of the substrate and a thickness ofa conductive layer located under the cover film.

According to a second aspect, provided is an electronic device,including:

the chip package structure, comprising: a chip, a substrate, a lead anda lead protection adhesive;

wherein the lead is configured to electrically connect the chip and thesubstrate;

the lead protection adhesive is configured to support the lead, whereina highest point of the lead protection adhesive is not higher than ahighest point of an upper edge of the lead.

According to a third aspect, provided is a method for preparing a chippackage structure, including:

forming a lead, the lead is configured to electrically connect a chipand a substrate;

a lead protection adhesive covers a first solder joint formed on asubstrate pad by the lead, and a tension of the lead protection adhesivecauses the lead protection adhesive to climb up along the lead until thelead protection adhesive covers a second solder joint formed on the pinpad by the lead.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of a terminal device to whichan embodiment of the present application is applied.

FIG. 2 is a schematic diagram of a chip package structure according toan embodiment of the present application.

FIG. 3 is a schematic diagram of another chip package structureaccording to an embodiment of the present application.

FIG. 4 is a schematic plan view of a chip package structure according toan embodiment of the present application.

FIG. 5 is a schematic structural diagram of another chip packagestructure according to an embodiment of the present application.

FIG. 6 is a schematic structural diagram of another chip packagestructure according to an embodiment of the present application.

FIG. 7 is a schematic structural diagram of another chip packagestructure according to an embodiment of the present application.

FIG. 8 is a schematic structural diagram of another chip packagestructure according to an embodiment of the present application.

FIG. 9 is a schematic structural diagram of another chip packagestructure according to an embodiment of the present application.

FIG. 10 is a schematic structural diagram of another chip packagestructure according to an embodiment of the present application.

FIG. 11 is a schematic plan view of a chip in a chip package structureaccording to an embodiment of the present application.

FIG. 12 is a schematic plan view of another chip in a chip packagestructure according to an embodiment of the present application.

FIG. 13 is a module structure diagram of a chip package structureaccording to an embodiment of the present application.

FIG. 14 is a schematic block diagram of an electronic device accordingto an embodiment of the present application.

DESCRIPTION OF EMBODIMENTS

Technical solutions in embodiments of the present application will bedescribed hereinafter with reference to the accompanying drawings.

An embodiment of the present application is applicable to various chips(Microchip), also referred to as integrated circuits (integratedcircuit, IC) or microcircuits (Microcircuit), which are circuitstructures integrated by a plurality of semiconductor devices that aregenerally fabricated on semiconductor wafers by semiconductorintegration circuit processes through steps such as thin filmdeposition, doping, photolithography and etching. The chip includes, butis not limited to, a sensor chip, a power supply chip, a signalprocessing chip, a logic control chip, a memory chip, and the like.

In an embodiment of the present application, the chip may be afingerprint sensor chip, and is configured to receive a fingerprintsignal such as a light wave signal, an acoustic wave signal, or apressure signal that carries fingerprint information, and convert thefingerprint signal into a corresponding electrical signal, so as todetect fingerprint information of a finger. The fingerprint sensor chipincludes, but is not limited to, an optical fingerprint sensor chip, anultrasonic fingerprint sensor chip, or a capacitive fingerprint sensorchip. For convenience of illustration, an optical fingerprint sensorchip is illustrated hereinafter as an example.

As a common application scenario, the optical fingerprint sensor chipprovided in an embodiment of the present application may be applied to asmart phone, a tablet computer, and other mobile terminals having adisplay screen or other terminal devices. More specifically, in theforegoing terminal devices, the optical fingerprint sensor chip may bespecifically disposed in an optical fingerprint apparatus, which may bedisposed in a partial region or an entire region under the displayscreen, thereby forming an under-display optical fingerprint system.Alternatively, the optical fingerprint identification apparatus may bepartially or entirely integrated into an interior of the display screenof the terminal device to form an in-display optical fingerprint system.

FIG. 1 illustrates a schematic structural diagram of a terminal deviceto which an embodiment of the present application may be applied. Theterminal device 10 includes a display screen 120 and an opticalfingerprint apparatus 130, where the optical fingerprint apparatus 130is disposed in a partial region under the display screen 120. Theoptical fingerprint apparatus 130 includes a fingerprint detectionregion 103. A light signal reflected or scattered by a region in thefingerprint detection region 103 where a finger is located may bereceived and detected by the optical fingerprint apparatus 130. Asillustrated in FIG. 1, the fingerprint detection region 103 is locatedin a display region of the display screen 120. In an alternativeembodiment, the optical fingerprint apparatus 130 may also be disposedat other positions, such as a side of the display screen 120 or anon-light transmitting region of an edge of the terminal device 10, anda light signal of at least part of the display region of the displayscreen 120 is guided to the optical fingerprint apparatus 130 through alight path design, such that the fingerprint detection region 103 isactually located in the display region of the display screen 120.

It should be understood that an area of the fingerprint detection region103 may be different from an area of a sensing array of the opticalfingerprint apparatus 130. For example, the area of the fingerprintdetection region 103 of the optical fingerprint apparatus 130 may belarger than the area of the sensing array of the optical fingerprintapparatus 130 through, for example, a lens imaging light path design, areflective folding light path design or other light path designs such aslight convergence or reflection. In other alternative implementationmanners, if the light path is directed in a manner of, for example,light collimation, the area of the fingerprint detection region 103 ofthe optical fingerprint apparatus 130 may also be designed to besubstantially identical with the area of the sensing array of theoptical fingerprint apparatus 130.

Thus, when a user needs to unlock the terminal device or perform otherfingerprint verification, a fingerprint input may be implemented merelyby pressing a finger on the fingerprint detection region 103 located onthe display screen 120. Since fingerprint detection may be implementedin the display, there is no need to exclusively reserve space for afront surface of the terminal device 10 adopting the foregoing structureto set a fingerprint button (such as a Home button), so that a fullscreen solution may be adopted; that is, the display region of thedisplay screen 120 may be substantially extended to an entire frontsurface of the terminal device 10.

As an alternative implementation manner, as illustrated in FIG. 1, theoptical fingerprint apparatus 130 includes a light detection portion 134and an optical component 132. The light detection portion 134 includesthe sensing array, a readout circuit and other auxiliary circuitselectrically connected with the sensing array, which is fabricated in anoptical fingerprint sensor chip by a semiconductor process; the sensingarray is specifically a photo detector array including a plurality ofphoto detectors distributed in an array, and the photo detectors may beused as an optical sensing unit as described above. The opticalcomponent 132 may be disposed above the sensing array of the lightdetection portion 134, and may specifically include a filter layer, alight directing layer or a light path directing structure, and otheroptical elements; the filter layer may be used to filter ambient lightpassing through a finger; and the light directing layer or light pathdirecting structure is mainly used to direct reflected light reflectedfrom a finger surface to the sensing array for optical detection.

In specific implementation, the optical component 132 and the lightdetection portion 134 may be encapsulated in the same opticalfingerprint member. For example, the optical component 132 and the lightdetection portion 134 may be encapsulated in the same opticalfingerprint chip, or the optical component 132 may be disposed outside achip where the light detection portion 134 is located; and for example,the optical component 132 is attached above the chip, or part ofelements of the optical component 132 are integrated into the foregoingchip.

There are various implementation solutions for the light directing layeror light path directing structure of the optical component 132; forexample, the light directing layer may be specifically a collimatorlayer fabricated on a semiconductor silicon wafer, which has a pluralityof collimating units or micro-hole arrays; and the collimating unit maybe a hole. Light in the reflected light reflected from the finger thatis vertically incident to the collimating unit may pass through thecollimating unit and be received by the optical sensing unit below it.However, light with an excessive large incident angle is attenuatedthrough multiple reflection inside the collimating unit, thus, eachoptical sensing unit may basically only receive the reflected lightreflected from a fingerprint pattern right above the optical sensingunit, and thus the sensing array may detect a fingerprint image of thefinger.

In another embodiment, the light directing layer or light path directingstructure may also be an optical lens layer having one or more lensunits, for example, a lens group composed of one or more asphericlenses, for converging reflected light reflected from the finger to thesensing array of the light detection portion 134 below it, so that thesensing array may perform imaging based on the reflected light so as toobtain the fingerprint image of the finger. Optionally, the optical lenslayer may be provided with a pinhole in the light path of the lens unit,and the pinhole may cooperate with the optical lens layer to expand thefield of view of the optical fingerprint apparatus, to improve afingerprint imaging effect of the optical fingerprint apparatus 130.

In other embodiments, the light directing layer or light path directingstructure may also specifically adopt a micro-lens layer having amicro-lens array constituted by a plurality of micro-lenses, which maybe formed above the sensing array of the light detection portion 134 bya semiconductor growth process or other processes, and each micro-lensmay correspond to one of the sensing units in the sensing arrayrespectively. Furthermore, other optical film layers such as adielectric layer or a passivation layer, may be formed between themicro-lens layer and the sensing unit, and more specifically, a lightblocking layer having a micro-hole may also be formed between themicro-lens layer and the sensing unit, where the micro-hole is formedbetween the corresponding micro-lens and the sensing unit, and the lightblocking layer may block optical interference between adjacentmicro-lenses and the sensing unit, such that light corresponding to thesensing unit is converged to an interior of the micro-hole through themicro-lens and is transmitted to the sensing unit via the micro-hole toperform optical fingerprint imaging. It should be understood thatseveral implementation solutions of the forgoing light path directingstructure may be used alone or in combination; for example, a micro-lenslayer may be further disposed under the collimator layer or the opticallens layer. Certainly, when the collimator layer or the optical lenslayer is used in combination with the micro-lens layer, a specificlaminated structure or light path may require to be adjusted accordingto actual needs.

It should be understood that, in a specific implementation, the terminaldevice 10 further includes a transparent protective cover; and the covermay be a glass cover or a sapphire cover, which is located above thedisplay screen 120 and covers a front surface of the terminal device 10.This is because, in an embodiment of the present application, theso-called finger pressing the display screen 120 actually refers to thefinger pressing the cover above the display screen 120 or a surface of aprotective layer covering the cover.

As an optional embodiment, the display screen 120 may adopt a displayscreen with a self-emitting display unit, such as an organic lightemitting diode (Organic Light-Emitting Diode, OLED) display screen or amicro light emitting diode (Micro-LED) display screen. Taking the OLEDdisplay screen that is adopted as an example, the optical fingerprintapparatus 130 may use the display unit (that is, an OLED light source)of the OLED display screen 120 located in the fingerprint detectionregion 103 as an excitation light source for optical fingerprintdetection. When a finger 140 presses a fingerprint detection region 103,the display screen 120 emits a beam of light 111 to the target finger140 above the fingerprint detection region 103, and the light 111 isreflected on an upper surface of a cover 110 to form reflected light,where a finger ridge closely contacts the cover 110 with no gap, andthere is a certain air gap between a finger valley and the cover 110,and thus, reflectance of the light 111 on a region where the fingerridge contacts the cover is 0, and reflectance of the light 111 on aregion where the finger valley contacts the cover is 4%. Thus, lightintensity of reflected light 151 formed by the light 111 that isreflected on the region where the finger ridge contacts the cover issmaller than that of reflected light 152 formed by the light 11 that isreflected on the region where the finger valley contacts the cover.After passing through the optical component 132, the reflected light isreceived by the sensing array 134 in the optical fingerprint apparatus130 and converted into a corresponding electrical signal, that is, afingerprint detection signal; and fingerprint image data may be obtainedbased on the fingerprint detection signal, and fingerprint matchingverification may be further performed, thereby implementing an opticalfingerprint identification function at the terminal device 10.

In other embodiments, the optical fingerprint apparatus 130 may alsoadopt a built-in light source or an external light source to provide alight signal for fingerprint detection. In this case, the opticalfingerprint apparatus 130 may be applicable to a non-self-emittingdisplay screen, such as a liquid crystal display screen or other passivelight-emitting display screens. Taking a liquid crystal display screenhaving a backlight module and a liquid crystal panel as an example, inorder to support under-display fingerprint detection of the liquidcrystal display screen, the optical fingerprint system of the terminaldevice 10 may further include an excitation light source for opticalfingerprint detection. The excitation light source may specifically bean infrared light source or a light source of non-visible light with aspecific wavelength, which may be disposed under the backlight module ofthe liquid crystal display screen or disposed in an edge region under aprotective cover of the terminal device 10. The optical fingerprintapparatus 130 may be disposed under the liquid crystal panel or the edgeregion of the protective cover, and light for fingerprint detection mayreach the optical fingerprint apparatus 130 by being directed by a lightpath. Optionally, the optical fingerprint apparatus 130 may also bedisposed under the backlight module, and the backlight module allows thelight for fingerprint detection to pass through the liquid crystal paneland the backlight module and reach the optical fingerprint apparatus 130by providing a hole on film layers such as a diffusion sheet, abrightening sheet, a reflection sheet or the like, or by performingother optical designs. When the optical fingerprint apparatus 130 isapplied to adopt a built-in light source or an external light source toprovide a light signal for fingerprint detection, a detection principleis consistent with the foregoing description.

On the other hand, in some embodiments, the optical fingerprintapparatus 130 may only include one optical fingerprint sensor chip; andin this case, the fingerprint detection region 103 of the opticalfingerprint apparatus 130 has a smaller area and a fixed position; andthus, when an fingerprint input is performed, the user needs to pressthe finger at a specific position of the fingerprint detection region103, otherwise the optical fingerprint apparatus 130 may not be able tocapture the fingerprint image, thereby resulting in poor userexperience. In other alternative embodiments, the optical fingerprintapparatus 130 may specifically include a plurality of opticalfingerprint sensor chips which may be disposed under the display screen120 side by side in a splicing manner, and sensing regions of theplurality of optical fingerprint sensor chips collectively constitutethe fingerprint detection region 103 of the optical fingerprintapparatus 130. In other words, the fingerprint detection region 103 ofthe optical fingerprint apparatus 130 may include a plurality ofsub-regions, each sub-region respectively corresponding to a sensingregion of one of the optical fingerprint sensor chips, so that thefingerprint capturing region 103 of the optical fingerprint apparatus130 may be extended to a main region of a lower portion of the displayscreen, that is, extended to a generally pressed region by the finger,thereby implementing a blind pressing type of a fingerprint inputoperation. Alternatively, when the number of the optical fingerprintsensor chips is sufficient, the fingerprint detection region 103 mayfurther be extended to half of the display region or even the entiredisplay region, thereby implementing half-screen or full-screenfingerprint detection.

It should also be understood that in an embodiment of the presentapplication that, the sensing array in the optical fingerprint apparatusmay also be referred to as a pixel array, and the optical sensing unitor sensing unit in the sensing array may also be referred to as a pixelunit.

It should be noted that the optical fingerprint apparatus in anembodiment of the present application may also be referred to as anoptical fingerprint identification module, a fingerprint identificationapparatus, a fingerprint identification module, a fingerprint module, afingerprint acquisition apparatus, and the like, and the foregoing termsmay be replaced with each other.

Generally, the optical component 132 and the optical detection portion134 may be packaged together as an optical fingerprint sensor chip 210or the optical detection portion 134 may be packaged separately as anoptical fingerprint sensor chip. For convenience of description, theoptical fingerprint sensor chip may also be referred to as a chiphereinafter.

Generally, after the chip is fabricated on the wafer, the chip ispackaged on the circuit board, which plays a role in placing, fixing,sealing, protecting the chip and enhancing electric heating performance.In addition, the chip is connected to an external circuit through thepackage.

FIG. 2 is a schematic diagram of a chip package structure 20. As shownin FIG. 2, a chip 210 is attached and fixed to a substrate 220 by a chipattaching adhesive 240, the chip 210 is provided with a pin pad 212, asubstrate pad 222 is formed on the substrate 220, and a lead 230implements an electrical connection between the chip 210 and thesubstrate 220 by connecting the pin pad 212 and the substrate pad 222.Specifically, in a process of soldering to form the lead 230, the lead230 forms a first solder joint on the pin pad 212 and a second solderjoint on the substrate pad 222.

In an existing package manner, as shown in FIG. 2, after the lead 230 isfabricated, dispensing is performed on the lead 230 and the first solderjoint and the second solder joint formed by soldering through adispensing process to form a sealing protection adhesive 260 thatcompletely covers the lead 230, the first solder joint and the secondsolder joint. A dispensing amount of the protection adhesive 260 islarger, and a height of the protection adhesive 260 is generally muchhigher than a height of the lead 230, so as to ensure that the lead canbe completely covered and protected. However, if this dispensing manneris employed, a thickness of the chip package structure 20 is increased,which is not conducive to achieving ultra-thinning of a chip packagestructure.

Based on this, according to an embodiment of the present application, aheight of a protection adhesive is controlled such that a highest pointof the protection adhesive is not higher than a highest point of thelead and the protection adhesive can support the lead, thereby avoidingan increase in an additional thickness of a chip package product andimplementing ultra-thinning of the product while the protection adhesivemay ensure mechanical reliability of the lead.

Chip package structures of embodiments of the present application willbe described in detail below with reference to FIGS. 3-13.

It should be noted that in the embodiments illustrated below, the samestructure is denoted by the same reference numeral for ease ofunderstanding, and detailed description of the same structure is omittedfor brevity.

FIG. 3 is a schematic structural diagram of a chip package structure 30according to an embodiment of the present application. The chip packagestructure 30 includes a chip 310, a substrate 320, a lead 330 and a leadprotection adhesive 360;

where the lead 330 is configured to electrically connect the chip 310and the substrate 320;

the lead protection adhesive 360 is configured to support the lead 330,where a highest point of the lead protection adhesive 360 is not higherthan a highest point of an upper edge 331 of the lead.

Specifically, in an embodiment of the present application, dispensing isperformed on the lead 330 by using the lead protection adhesive 360through a semiconductor adhesive dispensing process. As shown in FIG. 3,the lead protection adhesive 360 is disposed under the lead 330 tosupport the lead 330. Furthermore, the highest point of the leadprotection adhesive 360 is not higher than the highest point of theupper edge 331 of the lead 330, where the upper edge 331 of the lead 330is an upper edge of the lead in a radial direction, that is, an upperedge of a maximum radial cross section of the lead 330.

As shown in FIG. 3, a height of a highest point C of the lead protectionadhesive 360 may be denoted as a distance H1 between a plane where thehighest point C is located and an upper surface of the chip 310. Ahighest point A of the upper edge 331 of the lead 330 may also bedenoted as a distance H2 between a plane where the highest point A islocated and the upper surface of the chip 310. When the highest point Cof the lead protection adhesive 360 is not higher than the highest pointA of the upper edge 331 of the lead, that is, H1 is less than H2, thelead protection adhesive 360 does not make an increase in an additionalthickness of the chip package structure 30, and the chip packagestructure 30 can be thinned.

In the embodiment of the present application, the chip 310 may be thesame as the chip 210 in FIG. 2. The chip 310 is an integrated circuitfabricated on a semiconductor wafer through a semiconductor integratedcircuit process, and includes a circuit region and a non-circuit region,where the circuit region is located at the center of the chip 310, andthe non-circuit region is located in a peripheral edge of the chip 310.

Optionally, the chip 310 is a fingerprint sensor chip, and is configuredto receive a fingerprint signal such as a light wave signal, an acousticwave signal or a pressure signal that carries fingerprint informationand convert the fingerprint signal into a corresponding electricalsignal, so as to detect fingerprint information of a finger. The chip310 includes, but is not limited to, an optical chip, an ultrasonicchip, or a capacitor chip or the like.

Specifically, when the chip 310 is an optical fingerprint sensor chip,it is configured to receive a fingerprint detection signal returned byreflection or scattering of a human finger and detect fingerprintinformation of the finger based on the fingerprint detection signal.Optionally, the chip 310 may include a light detection portion 134 inFIG. 1, or include a light detection portion 134 and an opticalcomponent 132. For example, when the optical component 132 is amicro-lens array and a pinhole array, the micro-lens array and thepinhole array may be directly grown on a surface of the light detectionportion 134, and the optical component 132 and the light detectionportion 134 may be packaged together as a chip. It should be understoodthat when the chip 310 is an optical fingerprint sensor chip, the chippackage structure 30 may be a fingerprint identification apparatus.

Optionally, as shown in FIG. 3, the chip 310 is adhered to an uppersurface of the substrate 320 by the chip attaching adhesive 340.

Optionally, FIG. 4 is a schematic plan view of a chip package structureaccording to an embodiment of the present application. As shown in FIG.4, the chip 310 includes a detection circuit including a light detectionarray 3111 and a functional circuit 3112, and the light detection array3111 is configured to receive a fingerprint detection light signalreturned by reflection or scattering of a finger and obtain afingerprint detection electrical signal of the finger based on thefingerprint detection light signal.

Optionally, the light detection array 3111 includes a plurality of pixelunits, one pixel unit is configured to convert a light signal to form afingerprint detection electrical signal, and one fingerprint detectionelectrical signal corresponds to one pixel value in a fingerprint image.The pixel unit may be a photo diode, a metal oxide semiconductor fieldeffect transistor (Metal Oxide Semiconductor Field Effect Transistor,MOSFET) and other devices, and has higher light sensitivity and higherquantum efficiency to light at a target wavelength so as to facilitatedetection of a light signal at a corresponding wavelength. In onepossible implementation manner, the target wavelength belongs to aninfrared light band, and the light detection array is configured toreceive a fingerprint infrared light signal reflected by the finger toform a corresponding fingerprint electrical signal.

Optionally, the functional circuit 3112 includes, but is not limited to,a drive control circuit, a signal output circuit, or the like, and isconfigured to control a plurality of pixel units in the light detectionarray to operate and output electrical signals generated by theplurality of pixel units.

Specifically, the pin pad 312 is configured to output the fingerprintelectrical signal generated by the detection circuit to the substrate320 through the lead 330, to transmit the fingerprint electrical signalto other processing circuit units on the substrate. The processingcircuit unit includes, but is not limited to, a logic control circuit,an analog-to-digital conversion circuit, a signal processing circuit, adigital processing circuit, or the like.

Optionally, the pin pad 312 is further configured to receive a controlsignal generated by other control processing circuits on the substrate320. Optionally, the control signal may be generated by a control uniton the substrate 320 such as a microcontroller.

Optionally, in the embodiment of the present application, the substrate320 includes, but is not limited to, a printed circuit board (PrintedCircuit Board, PCB), a flexible printed circuit board (Flexible PrintedCircuit board, FPC), or a flexible and rigid combination board, or thelike, and is configured to carry and connect a plurality of electronicdevices and chips. The chip package structure 30 packaged with thesubstrate 320 may implement functions such as fingerprint identificationof a fingerprint sensor chip, processing of a fingerprint image.

Optionally, as shown in FIG. 5, when a highest point C of a leadprotection adhesive 360 is not higher than a highest point A of an upperedge of a lead 330, the highest point C of the lead protection adhesive360 is not higher than a highest point B of a lower edge 332 of the lead330, where the lower edge 332 of the lead 330 is a lower edge of thelead in a radial direction, that is, a lower edge of a maximum radialcross section of the lead 330. At this time, the lead protectionadhesive 360 has a less dispensing amount, and a lower height, and canalso support the lead.

Preferably, as shown in FIG. 6, when a highest point C of a leadprotection adhesive 360 is not higher than a highest point A of an upperedge of a lead 330, the highest point C of the lead protection adhesive360 is not lower than a highest point B of a lower edge 332 of the lead330, the lead protection adhesive 360 can fully support the lead 330, toensure that the lead 330 is not broken due to external pressure and hasgood mechanical reliability.

Preferably, as shown in FIG. 6, the lead protection adhesive 360 coversthe lower edge of the lead 330, but does not cover the upper edge of thelead 330, that is, the lower edge of the lead 330 is completely in thelead protection adhesive 360, but part of the upper edge of the lead 330is exposed beyond the lead protection adhesive 360. At this time, thelead 330 can be completely supported by the lead protection adhesive360, and a height of the lead protection adhesive 360 is not higher thana height of the lead 330, which could reduce a thickness of the chippackage structure 30 on the premise of ensuring good mechanicalreliability of the lead.

Specifically, a chip 310 includes at least one pin pad 312, and asubstrate includes at least one substrate pad 322. Hereinafter, thenumber of the pin pads 312 may be one or more, and the number of thesubstrate pads 322 may be one or more.

One pin pad 312 is correspondingly connected to one lead 330, and aplurality of pin pads 312 are correspondingly connected to a pluralityof leads 330, respectively. The lead 330 is specifically configured toelectrically connect the chip 310 and the substrate 320 by connectingthe pin pad 312 and the substrate pad 322.

Optionally, the pin pad 312 may be a metal pad such as a circular orsquare pad formed of metal copper. The substrate pad 332 may be a metalcopper pad on the substrate or a connecting finger of the substrate. Thelead 330 may be a gold (Au) wire, a copper (Cu) wire, a silver (Ag)wire, or other metal wires and alloy wires. The lead 330 may have a wirediameter between 15.2 μm and 25.4 μm, which is not limited in theembodiment of the present application.

Optionally, the lead protection adhesive 360 completely covers a firstsolder joint formed on the substrate pad 322 by the lead 330 and asecond solder joint formed on the pin pad 312 by the lead, and isconfigured to protect the first solder joint and the second solderjoint, and prevent the first solder joint and the second solder jointfrom being corroded by water vapor or other external environmentalfactors, thereby ensuring good environmental reliability.

Optionally, during a dispensing process, dispensing is performed at awire arc of the lead 330, and a dispensing amount is controlled so thatthe lead protection adhesive 360 flows to the first solder joint on thesubstrate pad 322 and the second solder joint on the pin pad 312 throughits own adhesive fluidity, and completely covers and protects the twosolder joints.

Optionally, the lead protection adhesive covers the first solder joint,and a tension of the lead protection adhesive causes the lead protectionadhesive to climb up along the lead until the lead protection adhesivecovers the second solder joint. Specifically, the lead protectionadhesive is a thermosetting adhesive, which has the characteristics ofinitially being in a flowing state and solidifying to a solid stateafter baking (a lead protection adhesive may also be an adhesive curedby ultraviolet light). The lead protection adhesive is in a liquid statebefore curing. After covering the first solder joint, due to a surfacetension and the capillary phenomenon of the liquid, the lead protectionadhesive climbs up the lead until it covers the second solder joint. Inorder to achieve better protection of the lead, a lead protectionadhesive with better fluidity is generally selected. At the same time,plasma cleaning is performed on the product before dispensing toactivate the surface energy of the lead, so that the lead protectionadhesive can climb smoothly.

Optionally, a wire bonding technology is adopted to fabricate the lead330 so as to connect the pin pad 312 and the substrate pad 322.

Optionally, in the embodiment of the present application, an arc heightH of the lead 330 fabricated by the wire bonding technology may be anyvalue, that is, a distance H between a plane where a highest point ofthe lead 330 is located and a surface of the chip 310 may be any value.Specifically, a value of the arc height H is related to a processparameter of the wire bonding.

The wire bonding technology includes two forms: ball bonding and wedgebonding. Basic steps of the two bonding technologies include: forming afirst solder joint, forming a lead, and finally forming a second solderjoint. In an embodiment of the application, the ball bonding or wedgebonding may be adopted for soldering; and the two bonding technologiesdiffer in a solder head and a manner of guiding a metal wire, but aresubstantively the same in specific soldering steps. An example of theball bonding is illustrated hereinafter.

Specifically, connecting the first solder joint and the second solderjoint by a ball bonding method includes the following steps:

(1) igniting or discharging on a metal wire to form a metal ball;

(2) placing the metal ball on a first pad, and applying a certainpressure on the first pad to form a first solder joint on the first padby thermal ultrasound;

(3) guiding the metal wire to extend upward to form a longitudinal wireneck of a lead;

(4) guiding the lead to bend and extend laterally to a second pad toform a wire arc of the lead;

(5) forming a second solder joint at the second pad by thermalultrasound; and

(6) lifting and breaking off the metal wire, re-igniting orre-discharging to form a new metal ball.

When a first pad is a pin pad 312 on a chip and a second pad is asubstrate pad 322 on a substrate, a process of connecting the first padand the second pad by using the foregoing ball bonding is generallyreferred to as forward wire bonding (forward loop); and when a first padis a substrate pad 322 on a substrate and a second pad is a pin pad 312on a chip, the process thereof is generally referred to as reverse wirebonding (reverse loop). Since the lead needs to extend upward at thefirst pad to form a wire neck and bend to form a wire arc, there is alimitation on an arc height of a wire arc above the first pad, and ifthe arc height is reduced, the wire neck will break off due to excessivebending, thereby resulting in lower reliability.

Generally, the chip 310 is disposed above the substrate 320, andtherefore an upper surface of the pin pad 312 is higher than an uppersurface of the substrate pad 322. When the forward wire bonding isadopted, as shown in FIG. 7, the pin pad 312 is a first pad, and thereis a limitation on an arc height H above the pin pad 312, therebyresulting in that a thickness of the chip package structure is limitedand increased. When the reverse wire bonding is adopted, as shown inFIG. 8, a substrate pad 322 is a first pad, since the lead itself needsto be pulled up and extended to a pin pad, a design of ultra-low archeight may be implementing by implementing bending of an arc in thepull-up and extension process; and compared with forward wire bonding,the arc height H is greatly reduced, and a ultra-low wire arc structureis implemented, so that a thickness of the chip package structure is notlimited, facilitating implementing a thin chip package structure 30.

It should be understood that the solution of the embodiment of thepresent application may be applied to the lead 330 formed by the forwardwire bonding, and may also be applied to the lead 330 formed by thereverse wire bonding, which is not limited in the embodiment of thepresent application.

Optionally, in an implementation manner of an ultra-low wire arc, thearc height H of the lead 330 is not greater than 35 μm, that is, thedistance H between the plane where the highest point of the lead 330 islocated and the surface of the chip 310 is not greater than 35 μm.

Optionally, a thickness of the chip 310 is generally 50 to 600 μm, athickness of the substrate 320 is generally 100 to 350 μm, a thicknessof the chip attaching adhesive 340 is generally 10 to 35 μm. Combinedwith the arc height of the lead 330 not more than 35 μm, the thicknessof the entire chip package structure 30 can be controlled below 1 mm,which is conducive to compressing the space occupied by the chip packagestructure in the electronic equipment in which it is located,facilitating the thin and light development of the electronic equipmentand improving the user experience.

Optionally, in one possible implementation manner, the reverse wirebonding is performed by using a stand-off stitch bond (Stand-off StitchBond, SSB) method to achieve an electrical connection. Specifically, aprocess of the SSB method is as follows:

(1) igniting or discharging on a gold wire to form a gold ball 350;

(2) placing the gold ball 350 on a pin pad 312;

(3) lifting and breaking off the gold wire, re-igniting orre-discharging on the gold wire to form a new gold ball;

(4) placing the gold ball on a substrate pad 322, and applying a certainpressure on the substrate pad 322 to form a first solder joint on thesubstrate pad 322 by thermal ultrasound;

(5) guiding the gold wire to extend upward to form a longitudinal wireneck;

(6) guiding the gold wire to bend and extend laterally to the pin pad312 to form a wire arc;

(7) applying a certain pressure on the gold ball 350 to form a secondsolder joint on the pin pad 312 by thermal ultrasound; and

(8) lifting and breaking off a lead, re-igniting or re-discharging onthe gold wire to form a new gold ball.

As shown in FIG. 9, the pin pad 312 and the substrate pad 322 areelectrically connected by adopting the SSB method, and the gold ballsare formed on both the pin pad 312 and the substrate pad 322; and inparticular, the gold ball 350 located on the pin pad 312 may protect thepin pad 312 from being damaged when the pressure is applied to the pinpad 312 and the solder joint is formed by thermal ultrasound, anintensity of the solder joint at the pin pad 312 may be improved, whichis conducive to improving reliability.

Specifically, in the process of packaging and soldering, the lead 330and the gold ball 350 are formed into an integral structure byultrasonic heat or other soldering methods.

Optionally, as shown in FIG. 9, when the ultra-low wire arc isimplemented by adopting the foregoing reverse wire bonding method, afirst segment of the lead in the lead 330 is located above the chip 310,and a distance D between the plane where the lowest point of the firstsegment of lead is located and the surface of the chip is not greaterthan 10 μm.

In particular, as shown in FIG. 10, when the distance D between thelowest point of the first lead and the surface of the chip is 0, thelead 330 may be in contact with the upper surface of the chip 310.

Optionally, the chip 310 further includes a test metal unit 313 disposedin an edge region of the chip that is not under the lead. Hereinafter,the number of the test metal units 313 may be one or more.

Specifically, according to an embodiment of the present application, ina process of fabricating a chip on a wafer, one chip 310 includes acircuit region and a non-circuit region, where the circuit regionincludes all circuit structures of the chip, the pin pad and otherregions with electrical characteristics that need to be actually used.The non-circuit region is a cut-off channel between chips and does notinclude a device or structure electrically connected to the chip. Aplurality of metal test units (test key) 313 are placed between thecircuit regions of the chip, that is, placed in the non-circuit regionof the chip, and the plurality of metal test units 313 are configured tomonitor a graph pattern of a semiconductor process, and may have thesame structure as a transistor or other semiconductor devices in a chipcircuit, including a stacked structure of the device such as a metallayer, a dielectric layer, a passivation layer, or the like. Generallyspeaking, in order to facilitate the connection of the chip and othercircuits, a metal layer is formed on a surface of the device in the chipcircuit, and accordingly, the metal layer is also formed on the surfaceof the plurality of metal test units.

It should be understood that in the embodiment of the presentapplication, the test metal unit 313 may also be a metal region or aconductive region for other functional purposes, such as a mark or aline of the metal material or other conductive materials, which is notlimited in the embodiment of the present application.

Specifically, as shown in FIG. 11, a plurality of pin pads 312 arelocated at an edge of the circuit region 301 to facilitate connectionwith other electronic components through a plurality of leads 330. Theplurality of test metal units 313 are located in the non-circuit region302, that is, a peripheral region of the chip 310, and are located aregion that is not under the plurality of leads 330.

Preferably, in one possible implementation manner, the pin pad 312 islocated on one side of the chip 310, and the test metal unit 313 islocated on other three sides of the chip 310. It should be understoodthat when the pin pad 312 is located on one side of the chip 310, thetest metal unit 313 may be located on any one or more of the other threesides of the chip 310. For example, as shown in FIG. 11, the pin pad 312is located on a right side of the chip 310, and the test metal unit 313is located on upper and lower sides of the chip 310. Optionally, thetest metal unit 313 may be located on only one side of the upper, loweror left sides of the chip 310, or on any two or three sides of theupper, lower and left sides of the chip 310.

Optionally, the pin pad 312 may also be located on two or three sides ofthe chip 310, and the test metal unit 313 may be located on other sidesof the chip 310.

Optionally, in another possible implementation manner, the test metalunit 313 may also be located on the same side as the pin pad 312. Forexample, as shown in FIG. 12, the pin pad 312 and the test metal unit313 are both located on the right side of the chip 310, where the lead330 is connected to the pin pad 312, and the one test metal unit 313 islocated in a region under and between the two leads 330, in other words,projection of the lead 330 on the chip 310 is located in a regionbetween the two test metal units 313 instead of in the test metal unit313.

According to a solution of an embodiment of the present application, thetest metal unit 313 is disposed at a position of an edge region of thechip 310 that is not under the lead 330, so that the following isavoided: when the pin pad 312 is electrically connected to the lead, theultra-low lead 330 is in contact with the test metal unit 313, therebycausing the pin pad 312 and the chip 310 to be damaged due to the shortcircuit connection between the pin pad 312 and the test metal unit 313.

In the foregoing, as shown in FIGS. 2-10, the chip 310 is disposed abovethe substrate 320, and the chip 310 is directly adhered to an uppersurface of the substrate 320 through a chip attaching adhesive 340; anda thickness of the chip package structure 30 may be reduced byoptimizing a height of the lead protection adhesive 360.

Further, the thickness of the chip package structure 30 may be furtherreduced by improving a positional relationship between the substrate 320and the chip 310.

Optionally, as illustrated in FIG. 13, an upper surface of the substrate320 extends downward to form a first groove 3201, and at least a portionof the chip 310 is disposed in the first groove 3201 and electricallyconnected to the substrate 320. For example, a lower surface of the chip310 is fixedly connected to a bottom of the first groove 3201 andelectrically connected to the substrate 320 through the lead 330.

Optionally, the chip 310 is disposed under a display screen, forexample, the display screen 120 in FIG. 1, through the substrate 320.When the chip 310 is an optical fingerprinting sensor chip, the chip 310is configured to receive a fingerprint detection signal returned byreflection or scattering via a human finger above the display screen120, and detect fingerprint information of the finger based on thefingerprint detection signal.

At least a portion of the chip 310 is disposed in the first groove 3201,which could effectively reduce the thickness of the package structure30; and the chip 310 is disposed under the display screen 120 throughthe substrate 320, which may avoid the use of an attaching adhesive tofixedly connect the chip 310 and the display screen 120, therebyreducing cost and complexity of an electronic device. For example, thesubstrate 320 is fixed to a middle frame of an electronic device inwhich the chip package structure 30 is located.

In some embodiments, the number of the chips 310 may be one or more. Forexample, the chip 310 may include a plurality of optical fingerprintsensor chips, and the plurality of optical fingerprint sensor chips arearranged side by side in the first groove to be spliced into an opticalfingerprint sensor chip component. The optical fingerprint sensor chipcomponent may be configured to acquire a plurality of fingerprint imagesat the same time, and the plurality of fingerprint images may be used asa fingerprint image for fingerprint identification after being spliced.With reference to FIG. 13, the chip 310 may be a sensor chip having alight detection array 3111. The light detection array 3111 may include aplurality of optical sensing units, and each of the optical sensingunits may specifically include a photo detector or a photoelectricsensor. In other words, the chip 310 may include a photo detector array(or referred to as a photoelectric detector array, and a photoelectricsensor array) including a plurality of photo detectors distributed in anarray.

With reference to FIG. 13, a size of the first groove 3201 is greaterthan a size of the chip 310 such that there is a gap between a side wallof the chip 310 and a side wall of the first groove 3201 foraccommodating the lead 330. In addition, the size of the first groove3201 is greater than the size of the chip 310, which may also reduceinstallation complexity and disassembly complexity of the chip 310.

A depth of the first groove 3201 may include a thickness of a cover filmof the substrate 320 and a thickness of a conductive layer located underthe cover film. The cove film of the substrate 320 may be an insulatinglayer for protecting and insulating the conductive layer under the coverfilm. The conductive layer located under the cover film is a circuitlayer or a wiring layer of the substrate 320, and the chip 310 mayachieve an electrical connection with an external device through thecircuit layer or the wiring layer of the substrate.

For example, the substrate 320 may include at least two conductivelayers. In this case, the depth of the first groove 3201 includes afirst conductive layer located under the cover film of the substrate320, the chip 310 may be electrically connected to a second conductivelayer under an insulating layer through a conductive through hole (forexample, a through hole penetrating the insulating layer under the firstconductive layer), and the chip 310 may thus be electrically connectedto the substrate 320.

With reference to FIG. 13, the chip 310 may be fixed in the first groove2301 by the chip attaching adhesive 340 for the chip 310.

It should be understood that the chip 310 may also be fixedly connectedto the side wall of the first groove 3201, or may be fixed in the firstgroove 3201 by other means. For example, the chip 310 may be fixed inthe first groove 3201 by a buckle or a screw, which is not specificallylimited in this embodiment.

With reference to FIG. 13, a lower surface of the substrate 320 mayfurther be provided with a double-sided adhesive 3203, so as to adherethe substrate 320 to a bottom of a groove of a middle frame of anelectronic device 30.

It should be understood that the substrate 320 may also be fixedlyconnected to a side wall of the groove of the middle frame, or thesubstrate 320 may be fixedly disposed in a groove of a middle frame byother means (such as a buckle or a screw), which is not specificallylimited in this embodiment of the present application.

With reference to FIG. 13, the upper surface of the substrate 320 may beprovided with a connecting finger 3202 of the substrate 320 formed at aside of the first groove 3201. In other words, the upper surface of thesubstrate 320 may be provided with a convex structure of the conductivelayer of the substrate 320 formed at a side of the first groove 3201, toform the connecting finger 3202 of the substrate 320.

It should be understood that a specific structure of the connectingfinger 3202 of the substrate 320 is not limited in the presentapplication. As an example, as illustrated in FIG. 13, the upper surfaceof the substrate 320 extends downward in a first region to form a secondgroove, the upper surface of the substrate 320 and an upper surface ofthe connecting finger of the substrate 320 form a second step in asecond region, the first region is a region where the connecting fingerof the substrate 320 is located on a side close to the first groove3201, and the second region is a region where the connecting finger ofthe substrate 320 is located on a side away from the first groove 3201.Further, a depth of the second groove may include a thickness of a coverlayer of the substrate 320 and a thickness of a conductive layer locatedunder the cover layer, and a thickness of the first step is thethickness of the conductive layer of the substrate 320 located under thecover layer such that a portion of the conductive layer of the substrate320 forms a convex structure with a convex surface facing upward,thereby forming the connecting finger 3202 of the substrate 320.

With reference to FIG. 13, the chip package structure 30 may furtherinclude a flexible circuit board 370 and an anisotropic conductiveadhesive film 391. The flexible circuit board 370 is provided with aconnecting finger 3701 of the flexible circuit board 370; and theconnecting finger 3701 of the flexible circuit board 370 is electricallyconnected to the connecting finger 3202 of the substrate 320 through theanisotropic conductive adhesive film 391.

For example, the connecting finger 3701 of the flexible circuit board370 may be located at one end of the flexible circuit board 370. Thatis, one end of the flexible circuit board 370 may be electricallyconnected to one end of the substrate 320 by laminating the anisotropicconductive adhesive film 391.

The substrate 320 and the flexible circuit board 370 are electricallyconnected through the connecting finger, which may not only ensureinsulativity between contact sheets, but also ensure conductivitybetween the substrate 320 and the flexible circuit board 370.Particularly, in a case that the chip 310 includes a plurality of chips,the plurality of chips on the substrate 320 may be quickly electricallyconnected to the flexible circuit board 370 through the connectingfinger, and thus installation complexity and disassembly complexitycould be reduced.

It should be understood that the specific structure of the connectingfinger 3701 of the flexible circuit board 370 is not limited in thepresent application. As an example, as illustrated in FIG. 13, a lowersurface of the flexible circuit board 370 may extend upward in a thirdregion to form a third groove, the lower surface of the flexible circuitboard 370 and a lower surface of the connecting finger of the flexiblecircuit board 370 may form a third step in a second region, the thirdregion is a region where the connecting finger 3701 of the flexiblecircuit board 370 is located on a side away from the first groove 3201,and the second region is a region where the connecting finger 3701 ofthe flexible circuit board 370 is located on a side close to the firstgroove 3201.

With reference to FIG. 13, the chip package structure 30 may furtherinclude a protection adhesive 392 for the anisotropic conductiveadhesive film 391, the protection adhesive 392 may be provided at bothends of the anisotropic conductive adhesive film 391 to protect theanisotropic conductive adhesive film 391, and further protect theconnecting finger 3202 of the substrate 320 and the connecting finger3701 of the flexible circuit board 370.

With reference to FIG. 13, the chip package structure 30 may furtherinclude a support 380 and a first foam layer 390, the first foam layer390 is disposed above the support 380 and provided with an openingpenetrating the first foam layer 390, and the chip 310 may receive afingerprint detection signal returned by reflection or scattering viathe finger through the opening of the first foam layer 390.

Optionally, the first foam layer 390 may be a foam layer of the chippackage structure 30, or may be a foam layer of the electronic devicelocated between the display screen 120 and the middle frame, which isnot specifically limited in the present application. In other words,when the first foam layer 390 is the foam layer of the chip packagestructure 30, the first foam layer 390 may be in direct contact with thedisplay screen 120, and further the first foam layer 390 may be in astate of compression; and when the first foam layer 390 is a foam layerof the electronic device located between the display screen 120 and themiddle frame, the chip package structure 30 is directly attached to alower surface of a foam layer under the display screen 120.

It should be understood that the support 380 may be formed of anymaterial that can be used to fixedly connect the substrate 320 and thefirst foam layer 390. For example, the support 380 may be a supportformed of a double-sided adhesive.

With reference to FIG. 13, a side wall of the support 380 that is closeto the chip 310 may be aligned with the side wall of the first groove3201 such that there is a gap between the support 380 and the chip 310for accommodating the lead 330.

The gap between the support 380 and the chip 310 may be used not only toaccommodate the lead 330, but also to accommodate the lead protectionadhesive 360, thereby ensuring conductivity of the lead 330 andperformance of the chip package structure 30. Moreover, the substrate320 may also be fixed under the display screen 120 through the flexiblecircuit board 370 such that the chip 310 is fixed under the displayscreen 120.

For example, as illustrated in FIG. 13, space for accommodating the leadprotection adhesive 360 includes, but is not limited to, a gap formedbetween the side wall of the chip 310 and the side wall of the firstgroove 3201, a gap formed between the chip 310 and the support 380, anda gap formed between the chip 310 and the first foam layer 390.

With reference to FIG. 13, the chip package structure 30 may furtherinclude a light path layer 314, and the light path layer 314 isconfigured to transmit the fingerprint detection signal returned byreflection or scattering via the finger to the chip 310. The light pathlayer 314 is disposed above the chip 310 and may be configured toachieve a light path design. In an embodiment of the presentapplication, the light path design of the light path layer 314 may referto the foregoing light path design of the optical component 132 of theoptical fingerprint apparatus 130, which is not repeatedly describedherein, and only a light path design adopting the micro-lens layer isselected as exemplary description. As an optional embodiment, the lightpath layer 314 includes a micro-lens layer and a light blocking layer,the micro-lens layer may have a micro-lens array formed by a pluralityof micro-lenses, the light blocking layer has a plurality of micro-holesand is disposed under the micro-lens layer, the micro-holes are inone-to-one correspondence with the micro-lenses, and pixel units of thelight detection array 3111 are in one-to-one correspondence with themicro-lenses. Optionally, the light path layer may further includeanother optical film layer, and specifically, other optical film layersmay also be formed between the micro-lens layer and the chip 310, forexample, a dielectric layer or a passivation layer. Optionally, thelight path layer 314 may further includes a filter disposed above themicro-lens layer or disposed in a light path between the micro-lenslayer and the chip 310. Reference may be made to the foregoing contentfor details and no further details are provided herein.

In an embodiment of the present application, the filter is used toreduce undesired ambient light in fingerprint sensing to improve opticalsensing of received light by the chip 310. The filter may bespecifically used to reject light with a specific wavelength, such asnear infrared light and part of red light etc. For example, humanfingers absorb most of the energy of light with the wavelengths under580 nm, if one or more optical filters or optical filtering layers aredesigned to reject light with wavelengths from 58 0nm to infrared light,undesired contributions to the optical detection in fingerprint sensingfrom the ambient light may be greatly reduced.

For example, the filter may include one or more optical filters, the oneor more optical filters may be disposed, for example, as bandpassfilters to allow transmission of the light emitted by an OLED screenwhile blocking other light components such as the infrared light in thesunlight. This optical filtering could be effective in reducingbackground light caused by the sunlight when using the under-screen chippackage structure 30 outdoors. The one or more optical filters may beimplemented as, for example, optical filter coating layers formed on oneor more continuous interfaces or may be implemented as one or morediscrete interfaces. It should be understood that the filter may befabricated on a surface of any optical member of the light path layer314 or on a light path along reflected light formed by reflection of thefinger to the chip 310, which is not specifically limited in thisembodiment of the present application.

In addition, a light incident surface of the filter may be provided withan optical inorganic coating or organic blackening coating layer, suchthat reflectance of the light incident surface of the filter is lowerthan a first threshold, for example, 1%, thereby ensuring that the chip310 is capable of receiving sufficient light signals to enhance theeffect of fingerprint identification.

For example, the filter is fixed to the upper surface of the chip 310through a fixing apparatus. The filter and the chip 310 may be fixed bydispensing in a non-photosensitive region of the chip 310, and there isa gap between the filter and a photosensitive region of the chip 310.Alternatively, a lower surface of the filter is fixed on the uppersurface of the chip 310 by glue having a refractive index lower than apreset refractive index, for example, the preset refractive indexincludes but is not limited to 1.3.

It should be noted that when the filter is attached to the upper surfaceof the chip 310 by filling of an optical adhesive, if a thickness of theadhesive covering the upper surface of the chip 310 is uneven, a Newtonring phenomenon may occur, thereby affecting the effect of fingerprintidentification.

Compared with the implementation manner in which the filter is fixedonto the chip 310 by the fixing apparatus, when the filter is a platedfilm on the chip 310 or another optical film layer, the use of a filter,such as a base material of blue glass or white glass is avoided, whichmay not only avoid the Newton ring phenomenon and further improve theeffect of fingerprint identification, but may also effectively reducethe thickness of the chip package structure 30.

With reference to FIG. 13, the chip package structure 30 may furtherinclude an image processor 371, which is electrically connected to thesubstrate 320. For example, the image processor 371 is disposed on theflexible circuit board 370 and electrically connected to the substrate320 through the flexible circuit board 370. For example, the imageprocessor 371 may be a micro processing unit (Micro Processing Unit,MCU) for receiving a fingerprint detection signal (for example, afingerprint image) transmitted from the chip 310 through the flexiblecircuit board 370, and simply processing the fingerprint detectionsignal.

With reference to FIG. 13, the chip package structure 30 may furtherinclude at least one capacitor 372, which is electrically connected tothe substrate 320 and configured to optimize the fingerprint detectionsignal captured by the chip 310. For example, the at least one capacitor372 is disposed on the flexible circuit board 370 and electricallyconnected to the substrate 320 through the flexible circuit board 370,thereby being electrically connected to the chip 310, and the at leastone capacitor 372 may be configured to optimize the fingerprintdetection signal captured by the chip 310. For example, the at least onecapacitor 372 is configured to filter the fingerprint detection signalcaptured by the chip 310, where the chip 310 may correspond to one ormore capacitors. For example, each chip in the chip 310 corresponds toone or more capacitors.

With reference to FIG. 13, the chip package structure 30 may furtherinclude a connector 373, which is electrically connected to thesubstrate 320. For example, the connector 373 may be electricallyconnected to the substrate 320 through the flexible circuit board 370.The connector 373 may be configured to connect with an externalapparatus or other members of the electronic device so as to enablecommunication with the external apparatus or other members of theelectronic device. For example, the connector 373 may be configured toconnect a processor of the electronic device such that the processor ofthe electronic device receives a fingerprint detection signal processedby the image processor 373 and performs fingerprint identification basedon the processed fingerprint detection signal.

It should be understood that FIG. 13 is only an example of the presentapplication and may not be understood as limiting the presentapplication.

For example, in some alternative embodiments, the chip 310 may beprovided with a through silicon via (Through Silicon Via, TSV) and/or aredistribution layer (Redistribution Layer, RDL), and the TSV and/or RDLis used to guide a pin of the chip 310 from an upper surface to a lowersurface. The lower surface of the chip 310 may be provided with a wiringlayer through the TSV and/or RDL. The wiring layer may be electricallyconnected to a wiring layer in the first groove 3201 of the substrate320 through the lead 330. In this case, an outer wall of the chip 310may be attached to the side wall of the first groove 3201, and a gap foraccommodating the lead 330 may be disposed between the lower surface ofthe chip 310 and the bottom of the first groove 3201. Further, the chip310 may be further provided with a protective layer on a surface of thewiring layer for protecting and insulating the chip 310.

Optionally, the support 380 may be a support formed of a material havingadhesive properties. For example, the support 380 may be a supportformed of a double-sided adhesive, but the embodiment of the presentapplication is not limited thereto. For example, the support 380 mayalso be a support formed of a material having no adhesive properties.For example, the material of the support 380 includes, but is notlimited to, metal, resin, a fiberglass composite plate or the like; andin this case, the support 380 needs to be fixed between the first foamlayer 390 and the substrate 320.

It should be understood that, when the support 380 is a supportstructure having no adhesive properties, in addition to the support 380,the chip package structure 30 may include a double-sided adhesive and asupport attaching adhesive, where a lower surface of the support 380 isconnected onto the upper side of the substrate 320 by the supportattaching adhesive, and an upper surface of the support 380 is connectedto the first foam layer 390 by the double-sided adhesive. As an optionalembodiment, the support 380 and the support attaching adhesive may alsobe an integral structure, and the integral structure serves as asupport. For example, the support may be a support formed of asingle-sided adhesive for connecting the substrate 320, and an uppersurface of the support is connected to the first foam layer 390 by thedouble-sided adhesive.

As illustrated in FIG. 14, the present application further provides anelectronic device 3 including a chip package structure 30 according toany one of the embodiments as mentioned above.

Optionally, the electronic device may further include a display screen120, and the chip package structure 30 is disposed under the displayscreen 120.

It should be appreciated that specific examples in embodiments of thepresent application are just for helping those skilled in the art betterunderstand the embodiments of the present application, rather than forlimiting the scope of the present application.

It should be appreciated that terms used in embodiments of the presentapplication and the claims appended hereto are merely for the purpose ofdescribing particular embodiments, and are not intended to limit theembodiments of the present application. For example, the use of asingular form of “a”, “the above” and “the” in the embodiments of thepresent application and the claims appended hereto are also intended toinclude a plural form, unless otherwise clearly indicated herein bycontext.

Those of ordinary skill in the art may be aware that, units of theexamples described in the embodiments disclosed in this paper may beimplemented by electronic hardware, computer software, or a combinationof the two. To clearly illustrate interchangeability between thehardware and the software, the foregoing illustration has generallydescribed composition and steps of the examples according to functions.Whether these functions are performed by hardware or software depends onparticular applications and designed constraint conditions of thetechnical solutions. Persons skilled in the art may use differentmethods to implement the described functions for each particularapplication, but it should not be considered that the implementationgoes beyond the scope of the present application.

In the several embodiments provided in the present application, itshould be understood that, the disclosed system and apparatus may beimplemented in other manners. For example, the described apparatusembodiment is merely an example. For example, the unit division ismerely logical function division and may be other division in actualimplementation. For example, a plurality of units or components may becombined or integrated into another system, or some features may beignored or not performed. In addition, the displayed or discussed mutualcoupling or direct coupling or communication connection may be indirectcoupling or communication connection through some interfaces,apparatuses or units, and may also be electrical, mechanical, orconnection in other forms.

The units described as separate parts may or may not be physicallyseparate, and parts displayed as units may or may not be physical units,may be located in one position, or may be distributed on multiplenetwork units. Part of or all of the units here may be selectedaccording to a practical need to achieve the objectives of the solutionsof an embodiments of the present application.

In addition, the respective functional units in an embodiments of thepresent application may be integrated in a processing unit, or therespective units exist separately and physically, or two or more unitsare integrated in one unit. The integrated unit may be implemented in aform of hardware, or may be implemented in a form of a softwarefunctional unit.

If the integrated unit is implemented in the form of the softwarefunctional unit and is sold or used as an independent product, it may bestored in a computer readable storage medium. Based on suchunderstanding, the nature of the technical solutions of the presentapplication, or the part contributing to the prior art, or all of orpart of the technical solutions may be implemented in a form of softwareproduct. The computer software product is stored in a storage medium andincludes several instructions for instructing a computer device (whichmay be a personal computer, a server, or a network device, and the like)to execute all of or part of the steps of the method described in anembodiments of the present application. The preceding storage mediumsincludes various mediums that may store program codes, such as, a Udisk, a removable hard disk, a read-only memory (Read-Only Memory, ROM),a random access memory (Random Access Memory, RAM), a magnetic disk, anoptical disk, or the like.

The foregoing descriptions are merely specific implementations of thepresent disclosure. The protection scope of the present application,however, is not limited thereto. Various equivalent modifications orreplacements may be readily conceivable to any person skilled in the artwithin the technical scope disclosed in the present application, andsuch modifications or replacements shall fall within the protectionscope of the present application. Thus, the protection scope of thepresent application shall be subject to the protection scope of theclaims.

What is claimed is:
 1. A chip package structure, comprising: a chip, asubstrate, a lead and a lead protection adhesive; wherein the lead isconfigured to electrically connect the chip and the substrate; the leadprotection adhesive is configured to support the lead; and a highestpoint of the lead protection adhesive is not higher than a highest pointof an upper edge of the lead.
 2. The chip package structure according toclaim 1, wherein the highest point of the lead protection adhesive isnot lower than a highest point of a lower edge of the lead.
 3. The chippackage structure according to claim 1, wherein the lead protectionadhesive covers a lower edge of the lead.
 4. The chip package structureaccording to claim 1, wherein the chip is an optical fingerprint sensorchip, and is configured to receive a fingerprint detection signalreturned by reflection or scattering of a human finger and detectfingerprint information of the finger based on the fingerprint detectionsignal.
 5. The chip package structure according to claim 1, wherein thechip comprises a pin pad and the substrate comprises a substrate pad;and the lead is configured to electrically connect the pin pad and thesubstrate pad.
 6. The chip package structure according to claim 5,wherein the lead protection adhesive covers a first solder joint formedon the substrate pad by the lead and a second solder joint formed on thepin pad by the lead, and is configured to protect the first solder jointand the second solder joint.
 7. The chip package structure according toclaim 5, wherein the lead is connected to the pin pad through a metalball.
 8. The chip package structure according to claim 7, wherein thelead and the metal ball are of an integral structure.
 9. The chippackage structure according to claim 7, wherein a first segment of thelead in the lead is located above the chip, and a distance between alowest point of the first segment of the lead and an upper surface ofthe chip is not greater than 10 μm.
 10. The chip package structureaccording to claim 5, wherein the chip further comprises: a test metalunit; and the test metal unit is disposed in an edge region of the chipthat is not under the lead.
 11. The chip package structure according toclaim 10, wherein the pin pad is located on one side of the chip, andthe test metal unit is located on at least one side of other three sidesof the chip.
 12. The chip package structure according to claim 5,wherein the lead is a lead fabricated from the substrate pad to the pinpad by employing a reverse wire bonding process.
 13. The chip packagestructure according to claim 1, wherein a distance between the highestpoint of the lead and an upper surface of the chip is not greater than35 μm.
 14. The chip package structure according claim 13, wherein thechip package structure further comprises a chip attaching adhesive,which connects the chip and the substrate; a thickness of the chip isbetween 50 μm and 600 μm, a thickness of the substrate is between 100 μmand 350 μm, and a thickness of the chip attaching adhesive is between 10μm and 35 μm.
 15. The chip package structure according to claim 1,wherein the lead is a gold wire, silver wire or copper wire; and/or thelead has a wire diameter of 15.2 μm to 25.4 μm.
 16. The chip packagestructure according to claim 1, wherein an upper surface of thesubstrate extends downward to form a first groove, and at least aportion of the chip is disposed in the first groove.
 17. The chippackage structure according to claim 16, wherein a size of the firstgroove is greater than a size of the chip such that there is a gap foraccommodating the lead between a side wall of the chip and a side wallof the first groove.
 18. The chip package structure according to claim16, wherein a depth of the first groove comprises a thickness of a coverfilm of the substrate and a thickness of a conductive layer locatedunder the cover film.
 19. An electronic device, comprising: the chippackage structure, comprising: a chip, a substrate, a lead, and a leadprotection adhesive; wherein the lead is configured to electricallyconnect the chip and the substrate; the lead protection adhesive isconfigured to support the lead; and a highest point of the leadprotection adhesive is not higher than a highest point of an upper edgeof the lead.
 20. A method for preparing a chip package structure,comprising: electrically connecting a pin pad of a chip and a substratepad of a substrate by a lead; covering a first solder joint formed onthe substrate pad by the lead, by a protection adhesive covers, whereina tension of the lead protection adhesive causes the lead protectionadhesive to climb up along the lead until the lead protection adhesivecovers a second solder joint formed on the pin pad by the lead.